Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding. Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times.

Market Analysis and Insights: Global Thin Wafers Temporary Bonding Equipment and Materials Market
The global Thin Wafers Temporary Bonding Equipment and Materials market size is projected to reach US$ XX million by 2027, from US$ XX million in 2020, at a CAGR of XX% during 2021-2027.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Thin Wafers Temporary Bonding Equipment and Materials market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Thin Wafers Temporary Bonding Equipment and Materials market in terms of revenue.
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Global Thin Wafers Temporary Bonding Equipment and Materials Scope and Market Size
Thin Wafers Temporary Bonding Equipment and Materials market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Thin Wafers Temporary Bonding Equipment and Materials market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type
Chemical Debonding
Hot Sliding Debonding
Mechanical Debonding
Laser Debonding

Segment by Application
< 100 µm Wafers
below 40µm Wafers

By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

By Company
3M
ABB
Accretech
AGC
AMD
Cabot
Corning
Crystal Solar
Dalsa
DoubleCheck Semiconductors
1366 Technologies
Ebara
ERS
Hamamatsu
IBM
Intel
LG Innotek
Mitsubishi Electric
Qualcomm
Robert Bosch
Samsung
Sumitomo Chemical