The global Heat Sinks market was valued at 127.08 Million USD in 2021 and will grow with a CAGR of 4.88% from 2021 to 2027, based on HNY Research newly published report.

The prime objective of this report is to provide the insights on the post COVID-19 impact which will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device`s temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.In the coming years there is an increasing demand for Heat Sinks in the regions of North America, Europe and Asia. In the past few years from 2013-2017, the global production and consumption developed stably. The global Heat Sinks market size in terms of production is projected to grow to 2447 M Pcs by 2025. At the same time, China is remarkable in the global Heat Sinks industry because of their market share and technology status of Heat Sinks. Other developing countries/region such as India and Southeast Asia grow at a good pace owing to large population and high economic growth rate, and they will play important role in the future. In the future, the production and consumption is estimated to continue developing with a stable growth rate. To meet the large and increasing demand, more and more manufacturers will go into this industry.

By Market Verdors:

Alpha

Molex

TE Connectivity

Delta

Mecc.Al

Ohmite

Aavid Thermalloy

Sunon

Advanced Thermal Solutions

DAU

Apex Microtechnology

Radian

CUI

T-Global Technology

Wakefied-Vette

By Types:

Aluminum Heat Sink

Copper Heat Sink

Copper Aluminum Heat Sink

By Applications:

Automobile Industry

Electronic Industry

Key Indicators Analysed

Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.

Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.

Market Trends: Market key trends which include Increased Competition and Continuous Innovations.

Opportunities and Drivers: Identifying the Growing Demands and New Technology

Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

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