Die Attach Adhesives for Semiconductor Market, Global Outlook and Forecast 2023-2028

Report ID: 1642231 | Published Date: Sep 2024 | No. of Page: 77 | Base Year: 2023 | Rating: 3.8 | Webstory: Check our Web story

Die attach adhesive is an insulator that is dispensed in a pattern, and is used to bond the opposite side of the circuit on an IC chip, which has conductive bumps, to a mounting substrate.
This report contains market size and forecasts of Die Attach Adhesives for Semiconductor in global, including the following market information:
Global Die Attach Adhesives for Semiconductor Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Die Attach Adhesives for Semiconductor Market Sales, 2017-2022, 2023-2028, (Tons)
Global top five Die Attach Adhesives for Semiconductor companies in 2021 (%)
The global Die Attach Adhesives for Semiconductor market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Insulating Type Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Die Attach Adhesives for Semiconductor include Dupont, Henkel, Namics, AI Technology, Advanced Packaging, DELO, Protavic, Master Bond and Nagase ChemteX. etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Die Attach Adhesives for Semiconductor manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Die Attach Adhesives for Semiconductor Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Die Attach Adhesives for Semiconductor Market Segment Percentages, by Type, 2021 (%)
Insulating Type
Sintering Type
Heat-curing Type
Global Die Attach Adhesives for Semiconductor Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Die Attach Adhesives for Semiconductor Market Segment Percentages, by Application, 2021 (%)
Consumer Electronic
Automotive Electronic
Optical Imaging Device
Global Die Attach Adhesives for Semiconductor Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Tons)
Global Die Attach Adhesives for Semiconductor Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Die Attach Adhesives for Semiconductor revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Die Attach Adhesives for Semiconductor revenues share in global market, 2021 (%)
Key companies Die Attach Adhesives for Semiconductor sales in global market, 2017-2022 (Estimated), (Tons)
Key companies Die Attach Adhesives for Semiconductor sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Dupont
Henkel
Namics
AI Technology
Advanced Packaging
DELO
Protavic
Master Bond
Nagase ChemteX

Frequently Asked Questions
Die Attach Adhesives for Semiconductor Market report offers great insights of the market and consumer data and their interpretation through various figures and graphs. Report has embedded global market and regional market deep analysis through various research methodologies. The report also offers great competitor analysis of the industries and highlights the key aspect of their business like success stories, market development and growth rate.
Die Attach Adhesives for Semiconductor Market report is categorised based on following features:
  1. Global Market Players
  2. Geopolitical regions
  3. Consumer Insights
  4. Technological advancement
  5. Historic and Future Analysis of the Market
Die Attach Adhesives for Semiconductor Market report is designed on the six basic aspects of analysing the market, which covers the SWOT and SWAR analysis like strength, weakness, opportunity, threat, aspirations and results. This methodology helps investors to reach on to the desired and correct decision to put their capital into the market.

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